"Burn in" is a very different thing than "break in". Burn in usually involves temperature cycling from an extreme high temp to an extreme low temp in a controlled environment chamber using hot-to-ambient and ambient to-cold temperature ramps determined by an engineer. It is used to weed out early-life-cycle component failures (faulty components tend to fail early in their life cycle) and solder issues (cold solder joints) or instabilities in circuit performance due to temp variations. It is usually done with the unit powered on while software tracks critical electrical performance parameters over time during hours of repetitive hot/cold cycles. It is also known as "accelerated life testing" and is critical to ensuring consistent and reliable product performance in mission critical applications like the computers that run Wall Street, government communications/data storage, large internet hubs, etc.
How do I know this: 20 years of running business units/divisions that built thousands of mission-critical computing and networking products for IBM, Cisco Systems, Lucent, Nortel, Sun Micro, etc.
If all audio products were burned in this way, break in would be minimal as it would only require enough time for the temp to stabilize as the components would already have seasoned due to the accelerated life testing. They would also cost a hell of a lot more.
Dave
How do I know this: 20 years of running business units/divisions that built thousands of mission-critical computing and networking products for IBM, Cisco Systems, Lucent, Nortel, Sun Micro, etc.
If all audio products were burned in this way, break in would be minimal as it would only require enough time for the temp to stabilize as the components would already have seasoned due to the accelerated life testing. They would also cost a hell of a lot more.
Dave