Before getting too carried away, a lot of metal science is carried out at very low temperatures and DC, neither of which apply in audio. As temperatures and frequency rise, performance tends to converge.
Back in the 80’s, we found that dielectric and geometry trumped metallurgy in an audio interconnect application. Cu, OFC and LCC all sounded pretty much the same with the same dielectric and geometry. Plain Cu with better dielectric and optimized geometry bested better metal with sub-optimal dielectric or geometry.
As Galeis points out, cables alter the phase relationship across the audio spectrum. Loudspeakers, and to a lesser extent electronics, do so as well. All interact to create a unique signature for that system alone.
The goal is to achieve a reasonable balance for the best musicality.
That can only be ascertained in situ.
Back in the 80’s, we found that dielectric and geometry trumped metallurgy in an audio interconnect application. Cu, OFC and LCC all sounded pretty much the same with the same dielectric and geometry. Plain Cu with better dielectric and optimized geometry bested better metal with sub-optimal dielectric or geometry.
As Galeis points out, cables alter the phase relationship across the audio spectrum. Loudspeakers, and to a lesser extent electronics, do so as well. All interact to create a unique signature for that system alone.
The goal is to achieve a reasonable balance for the best musicality.
That can only be ascertained in situ.