HiFi,
Let me give this a try.....Big, check and see if we're getting this.
The semiconductor will, under use simply go to some temp above ambient and stay there, depending on load. The device HAS to be warmer than the heatsink.
I don't know...If you chill the sink to 30f while the device is at 90f? The device will first cool, than begin pumping heat back into the system raising its temp.
HERE:: READ THIS.....
I'm going to go thru it. I already see it makes sense of this and the math part isn't too bad.
http://homepages.which.net/~paul.hills/Heatsinks/HeatsinksBody.html
BigBucks. Please read above link and see if it meets your approval. It seems straightforward explained this way.
One further question, however.......and that deals with maximum power dissipation of semiconductor devices as well as the maximum junction temp allowed.....all apparently related back to ambient temp and the thermal resistance of the system.....
cheers........
Let me give this a try.....Big, check and see if we're getting this.
The semiconductor will, under use simply go to some temp above ambient and stay there, depending on load. The device HAS to be warmer than the heatsink.
I don't know...If you chill the sink to 30f while the device is at 90f? The device will first cool, than begin pumping heat back into the system raising its temp.
HERE:: READ THIS.....
I'm going to go thru it. I already see it makes sense of this and the math part isn't too bad.
http://homepages.which.net/~paul.hills/Heatsinks/HeatsinksBody.html
BigBucks. Please read above link and see if it meets your approval. It seems straightforward explained this way.
One further question, however.......and that deals with maximum power dissipation of semiconductor devices as well as the maximum junction temp allowed.....all apparently related back to ambient temp and the thermal resistance of the system.....
cheers........