I went from Class D to Luxman A/AB - And most of what you think is wrong

Yes, but Cleese was acting

You know exactly what I'm talking about and twisting it once again, still shilling for your self and abusing any opposition. Stay with tubes sunshine, you'll be better off.    

@georgehifi If this comment is directed at me, could you explain how I was twisting your words? Are you saying that surface mount boards are only done on machines and can't be done by hand? How am I abusing you? Have you tried reporting my post to moderation? I think you will find that the post stands because I've made no personal attack, although I have debunked your statements which is allowable under forum rules.

Have you tried reporting my post to moderation? 

No need to, because I see it has been removed, as admin must have read into your twisted response, and self shilling agenda.
  
They're not stupid and know it's impossible to create a "retail product" complete Class-D board, using all smd components, making it by hand soldering.
You say it can be done, but that would only be a 1 off prototype and not the production version.

I think you will find that the post stands because I've made no personal attack

Tweak didn't think so as he responded to your comment, which should also be removed, but then he's just your lackey .

@atmasphere  Ralph, perhaps I can help a little with SMT question (although you may already know all this) .  Suggestion to use wave soldering for your production is nonsense.  It was replaced by reflow soldering more than decade ago.  The only all SMD done with wave soldering today are low density high production quantity boards  (wave soldering is a little faster than reflow).  Even mixed boards are today soldered with reflow ovens + selective soldering (mini solder fountain).  Limitation of wave soldering is at about 20 mil pitch, but board has to be designed for that (orientation of components) and everything else has to be perfect.  It is perhaps good for 25mil pitch only (compromised adhesion of thin solder dam between pins causes shorts).  Also, board has to be designed for wave soldering in mind since recommended component land areas are different - wider (take more space).  I would design everything for reflow.  Hand soldering prototype with 50mil pitch components is easy.  I can do 25mil pitch large chips with 3D magnifier (Mantis) and micro soldering iron, but it is time consuming.  I've seen technicians who can solder 20mils.  For discrete components 0402 is the limit (already hard to rework).  0603 is practical and easy.  Best bet for small operation soldering would be manual stencil and small 4 zone reflow oven (bigger number of zones is mostly for production speed - faster conveyer belt).  Vapor Phase (drawer style) soldering might be also a good option (more accurate).  Better yet leave it to good Assembly House.  They make prototype quantities and small batches.  They often can buy parts at lower cost.  I went thru about 10 assembly houses before I found one that is wonderful.  Location doesn't really matter since you send them zip file and they ship back boards (leave everything to them!).   Novatronix in Chicago area is the best I know.  Sure, it will cost you more in prototype quantity, not to mention set-up charges, but debugging and testing poorly made board can cost you a lot of time (and frustration, and wrong decisions).  I went thru all this.
For your size of operation Altium software is most likely optimal.

Sorry, for all these details, but it goes toward possibility of making own design class D SMT boards vs using standard off the shelf modules.  The answer is - yes it can be done, many ways.