Dyn,
I've worked semiconductor manufacturing for decades....in the fab. I've helped make enough ICs and Discrete components to sink a ship. All changes to procedures are vetted and go thru a sign off loop, with the exception of the 'temporary' change which has a few special provisions and has a 24 hour time limit and is used only as an emergency containment or if a specific piece of equipment is down.
But, the REAL question is one of training and quality management system. For example, is the facility in question ISO audited? Are all employees trained and certified in the operations they perform? Are quality records kept? Rework procedures approved and certified? and on and on.
I've worked semiconductor manufacturing for decades....in the fab. I've helped make enough ICs and Discrete components to sink a ship. All changes to procedures are vetted and go thru a sign off loop, with the exception of the 'temporary' change which has a few special provisions and has a 24 hour time limit and is used only as an emergency containment or if a specific piece of equipment is down.
But, the REAL question is one of training and quality management system. For example, is the facility in question ISO audited? Are all employees trained and certified in the operations they perform? Are quality records kept? Rework procedures approved and certified? and on and on.