Hi Jay . . . the most basic model of a real-world capacitor is an ideal capacitor in series with both an inductor and a resistor. For a high-quality film cap, the inductance comes from the leads and the fact that it's impossible to acheive a perfect "non-inductive" wind to the film/foil itself. Series resistance comes from the leads and the (usually crimped) connection from the leads to the foil. Virtally all of these non-ideal properties increase with the physical size of the capacitor, especially inductance. Larger caps also tend to be more suceptible to crosstalk from nearby inductors.
For electrolytics there are additional losses and parasitic properties from the electrolytes, which can be signal-modulated and heat-modulated. And while these properties do get better with physically larger capacitors, doubling the number tends to make much larger improvements than merely increasing the physical size, and it does so without incrasing inductance. And if there is significant ripple current (causing heat), two caps will disipate the heat much better than one, given the greater surface area.
Compared to all of this, any solder-joint of reasonable workmanship is but a tiny grain of sand on the beach. The biggest vulnerability would be for i.e. a production wave-soldered PC board, which frequently has "thermal" pads of significant resistance . . . but even in this case, paralleling two smaller caps would mean less weight (hence less vibration stress) on each connection, and the resistance of the board traces and thermal pads would be in parallel. So, still an improvement.
For electrolytics there are additional losses and parasitic properties from the electrolytes, which can be signal-modulated and heat-modulated. And while these properties do get better with physically larger capacitors, doubling the number tends to make much larger improvements than merely increasing the physical size, and it does so without incrasing inductance. And if there is significant ripple current (causing heat), two caps will disipate the heat much better than one, given the greater surface area.
Compared to all of this, any solder-joint of reasonable workmanship is but a tiny grain of sand on the beach. The biggest vulnerability would be for i.e. a production wave-soldered PC board, which frequently has "thermal" pads of significant resistance . . . but even in this case, paralleling two smaller caps would mean less weight (hence less vibration stress) on each connection, and the resistance of the board traces and thermal pads would be in parallel. So, still an improvement.