Here's what a google search on high fidelity cables turns up on the technology from the vendor's website.
The accounting DD cites would seem to have some discrepancies, for example the website mentions exposing the wire to magnetic fields as part of the manufacturing process and there being magnets in the connectors, but nothing about magnets at strategic intervals inside the ICs.
"Inside our
interconnects, we strategically place a series of
magnets of varying sizes and strengths, placed
around a solid core metal conductor at strategic
intervals in a north-south/north-south configuration."
SO I'm not sure where DD gets his info or if he is even relating it correctly, but that would seem to be a major difference.
The accounting DD cites would seem to have some discrepancies, for example the website mentions exposing the wire to magnetic fields as part of the manufacturing process and there being magnets in the connectors, but nothing about magnets at strategic intervals inside the ICs.
"Inside our
interconnects, we strategically place a series of
magnets of varying sizes and strengths, placed
around a solid core metal conductor at strategic
intervals in a north-south/north-south configuration."
SO I'm not sure where DD gets his info or if he is even relating it correctly, but that would seem to be a major difference.